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Субстрат SiC
Created with Pixso. 4H-N Type SiC Substrate 10x10mm Wafer for Power Electronics

4H-N Type SiC Substrate 10x10mm Wafer for Power Electronics

Наименование марки: ZMSH
Номер модели: SiC субстрат 10×10 мм
MOQ: 25
цена: by case
Время доставки: 2-4 недели
Условия оплаты: Т/Т
Подробная информация
Место происхождения:
Китай
Сертификация:
rohs
Тип:
4H-SiC
Стандартные размеры:
10×10 мм (допуск ±0,05 мм)
Варианты толщины:
100-500 мкм
Удельное сопротивление:
00,01-0,1 Ω·cm
Теплопроводность:
490 W/m·K (типичный)
ПриложенияУстройства:
Новые энергетические транспортные средства силовые агрегаты, аэрокосмическая электроника
Упаковывая детали:
упаковка в комнате для очистки 100 классов
Поставка способности:
1000 шт в месяц
Выделить:

4H N Type SiC Substrate

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N Type SiC Substrate 10x10mm

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Power Electronics SiC Substrate

Характер продукции
4H-N Type SiC Substrate 10*10 mm – Customizable Semiconductor Wafer
Product Overview

The 4H-N type SiC 10*10 mm small wafer is a high-performance semiconductor substrate based on silicon carbide (SiC), a third-generation semiconductor material. Fabricated via Physical Vapor Transport (PVT) or High-Temperature Chemical Vapor Deposition (HTCVD), it is available in 4H-SiC or 6H-SiC polytypes and N-type or P-type doping configurations. With dimensional tolerances within ±0.05 mm and surface roughness Ra < 0.5 nm, each wafer is epitaxial-ready and undergoes rigorous inspection, including XRD crystallinity validation and optical microscopy defect analysis.

4H-N Type SiC Substrate 10x10mm Wafer for Power Electronics 0

Technical Specifications
ParameterSpecification
Material Type4H-SiC (N-type doped)
Dimensions10*10 mm (±0.05 mm)
Thickness100–500 μm
Surface RoughnessRa < 0.5 nm (polished)
Resistivity0.01–0.1 Ω·cm
Crystal Orientation(0001) ±0.5°
Thermal Conductivity490 W/m·K
Defect DensityMicropipes: <1 cm⁻²; Dislocations: <10⁴ cm⁻²
Key Technical Features
  • High Thermal Conductivity: 490 W/m·K, three times that of silicon, enabling efficient heat dissipation.
  • Breakdown Strength: 2.4 MV/cm, supporting high-voltage and high-frequency operation.
  • High-Temperature Stability: Operational up to 600°C with low thermal expansion (4.0*10⁻⁶/K).
  • Mechanical Durability: Vickers hardness 28–32 GPa, flexural strength >400 MPa.
  • Customization Support: Adjustable orientation, thickness, doping, and geometry.
Core Applications
  • Electric vehicle power inverters (3–5% efficiency gain)
  • 5G RF power amplifiers (24–39 GHz bands)
  • Smart grid HVDC converters and industrial motor drives
  • Aerospace sensors and satellite power systems
  • UV LEDs and laser diodes

4H-N Type SiC Substrate 10x10mm Wafer for Power Electronics 1

Related Products
  1. 4H-N SiC Substrate, 5*5 mm, 350 μm (Prime/Dummy Grade)
  2. Custom-shaped SiC wafers with backside metallization
FAQ

Q: What are typical applications of 10*10 mm SiC wafers?

A: Ideal for prototyping power devices (MOSFETs/diodes), RF components, and high-temperature optoelectronics.

Q: How does SiC compare to silicon?

A: SiC offers 10* higher breakdown voltage, 3* better thermal conductivity, and superior high-temperature performance.

Why choose ZMSH company
  1. Complete production chain from cutting to final cleaning and packing.
  2. Capability to reclaim wafers with diameters 4-inch—12-inch.
  3. 20 year experience of wafering and reclaiming of monocrystalline electronic materials

ZMSH Technology can provide customers with imported and domestic high-quality conductive, 2-6inch semi-insulating and HPSI (High Purity Semi-insulating) SiC substrates in batches; In addition, it can provide customers with homogeneous and heterogeneous silicon carbide epitaxial sheets, and can also be customized according to the specific needs of customers, with no minimum order quantity.

Tags:

SiCWafer #4HSiC #PowerElectronics #Semiconductor #10x10mm #CustomWafer #HighTemperature

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