Sapphire Multi-Wire Saw Machine for Sapphire/SiC/Quartz Materials
The Sapphire Multi-Wire Saw is a precision machining device designed for hard and brittle materials (e.g., sapphire, silicon carbide, quartz, optical glass). It employs high-speed reciprocating motion of hundreds of diamond-coated wires to achieve efficient slicing of ingots. With fewer guide wheels (typically 3–5), the system enhances stability and cost-effectiveness. Suitable for ingots up to Φ300mm, it enables simultaneous slicing of 800–1,200 wafers per cycle, achieving ±0.02mm thickness tolerance and surface roughness Ra < 0.5μm. Applications span LED substrates, consumer electronics cover plates, military windows, and more.
Compared to traditional multi-wire saws, this device utilizes closed-loop tension control (10–30N range) and intelligent threading systems, improving wire utilization by 40% and reducing consumable costs by 30%, while meeting efficiency, stability, and economic demands.
Sapphire Multi-Wire Saw Machine Working Principles
1. Multi-Wire Drive System
- Main motor drives active wheel sets (Φ300–500mm diameter), forming a closed-loop network with 300–800 diamond wires at speeds up to 1,000m/min.
- 7 servo motors coordinate motion (wire payout/reel, threading, spindle, tension, feed, oscillation) with ±0.005mm precision.
2. High-Tension Cutting Mechanism
- Closed-loop tension sensors (1kHz sampling) dynamically adjust servo torque, maintaining tension fluctuations < ±2%.
- Fiber-optic breakage detection with <10ms response triggers automatic shutdown and fault localization.
3. Intelligent Control System
- Inovance PLC + servo architecture supports ≥100 preset process parameters (speed, tension, feed rate).
- 10.1" touchscreen displays real-time wire network status, tension curves, energy consumption, and fault logs (historical tracking).
4. Cooling & Filtration
- High-pressure cooling (0.5–1.5MPa) with 5μm filtration ensures <35°C cutting zone temperature.
- Auto-concentration water-based coolant system (±0.5% accuracy).
Sapphire Multi-Wire Saw Machine Technical Advantages
| Category |
Technical Details |
Benefits |
| Structural Design |
Q345B steel frame with finite element optimization (natural frequency >80Hz) |
50% vibration resistance improvement; stable operation under high humidity. |
| Control Precision |
7 servo motors + 17-bit absolute encoders (±0.002mm repeatability) |
Accurate crystallographic orientation matching (e.g., C/R-face cutting). |
| Tension System |
Dual-loop control (current + position loops; <±0.3N fluctuation) |
99.5% yield rate; wire breakage losses <0.1%. |
| Process Adaptability |
Recipe manager for material presets (e.g., sapphire hardness 2000HV) |
3-minute material switching; reduced trial cutting losses. |
| Smart Features |
Ethernet/IP integration with MES systems; 3-tier access control |
Real-time OEE data upload; compliance with Industry 4.0 standards. |
| Cost Efficiency |
0.8–1.2m wire consumption per slice (Φ0.25mm wire); |
30% lower wire usage; rapid wire diameter switching (0.15–0.45mm). |
Sapphire Multi-Wire Saw Machine Technical Parameters
|
Power supply
|
Three-phase five-wire system with AC 380V and 50A capacity
|
|
Power consumption
|
Less than 25KVA
|
|
Spindle speed
|
400-1200m/min
|
|
Work table elevation stroke
|
200mm
|
|
Work table slicing feed speed
|
0mm-1000mm/h
|
|
Swing angle
|
±8º
|
|
MAX work size
|
350 X 200 X 200mm
|
|
Wire reel capacity
|
20km
|
|
Wire diameter
|
∅0.1-∅0.28mm
|
|
Roller outer diameter effective length axes
|
160mm X 350mm X 3strip
|
|
Steering wheel number
|
8 pieces
|
|
Machine net weight
|
5500kg
|
|
MAX work size
|
350 X 200 X 200mm
|
Sapphire Multi-Wire Saw Machine Applications
1. LED Industry:
- 2–6" sapphire substrates (80–350μm thickness) for Micro-LED chips.
- Patterned substrates (PSS) with Ra <0.2μm.
2. Consumer Electronics:
- Smartwatch sapphire covers (0.3–0.8mm thickness; <10μm edge chipping).
- Smartphone camera lens protectors.
3. Optical & Defense:
- Infrared windows (0.5–5mm; <0.01mm parallelism).
- Missile radome sapphire blanks (thermal shock resistance >1000°C).
4. Semiconductors:
- 4H-SiC epitaxial wafers (TTV <5μm).
- GaN wafer slicing (<30μm warpage).
5. Research:
- Ultra-thin flexible sapphire (<50μm).
- Complex-shaped components (min. radius R0.5mm).
Sapphire Multi-Wire Saw Machine Key Advantages
1. Stability:
- ±0.002mm repeatability; <0.02mm warpage.
- Max. workpiece size: 260×260×250mm.
- Huagong servo motors ensure reliability.
2. Energy Efficiency:
- Water-recycling system minimizes solid waste.
- Servo-driven power: 27.2KVA (3% hourly consumption).
3. Cost-Effectiveness:
- Dual-position cutting doubles efficiency.
- Integrated process support (training, troubleshooting).
4. Price Leadership:
- <1/3 the cost of foreign equivalents.
- Rapid ROI; reduced operational risks.
Sapphire Multi-Wire Saw Machine FAQ
Q1: What are the core advantages of sapphire multi-wire saws?
A1: High-throughput batch cutting (800–1,200 wafers per cycle), ±0.02mm thickness tolerance, and Ra <0.5μm surface roughness, ideal for high-precision applications like LED substrates and military windows.
Q2: How to address non-circular sapphire cutting?
A2: Optimize cutting parameters (wire speed/tension) and wire mesh alignment, ensuring guide wheel diameter >300mm to minimize diamond wire distortion.
Tag: #Sapphire Multi-Wire Saw Machine, #Customized, #Sapphire/SiC/Quartz Materials
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